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Málaga, Spain – September 23, 2026 – TFC, a leading one-stop optical interconnect technology company, successfully concluded its participation at ECOC 2026, connecting with global customers, partners and industry professionals to exchange insights on the latest developments in high-speed optical interconnect technologies. 

As AI infrastructure continues to drive demand for higher bandwidth, higher density and greater scalability, TFC highlighted its capabilities in High-Speed Optical Engines, ELSFP modules, optical components such as FAUs and Fiber Shuffle Boxes, and customized optical packaging. TFC continues to advance its technologies and manufacturing capabilities in critical optical components, optical packaging and silicon photonics integration, supporting evolving connectivity.

In addition, TFC's SiPh Wafer Back-end Technology Platform further strengthens its silicon photonics integration capabilities, providing end-to-end manufacturing support through TFC's global manufacturing network. 

ECOC 2026 provided a valuable opportunity to strengthen customer relationships, deepen industry collaboration, and gain further insights into evolving market and technology trends. 

Looking ahead, TFC will continue advancing its capabilities in optical components, optical packaging and silicon photonics, supporting the evolving connectivity requirements of AI data centers and next-generation high-speed optical communication applications. 

Thank you to everyone who visited the TFC booth and connected with our team at ECOC 2026. We look forward to seeing you in Milan at ECOC 2027.